New Embedded Programs That Can Face up to Excessive Temperatures

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New modules include 11th Gen Intel Core processors and are constructed for out of doors and in-vehicle purposes

congatec has launched six new Computer-on-Modules with 11th Gen Intel Core processors for the prolonged temperature vary. Constructed with high-quality elements designed to resist excessive temperatures from -40 levels Celsius to +85 levels Celsius, the brand new COM-HPC and COM Express Type 6 Computer-on-Modules present all options and providers required for dependable operation in probably the most difficult environments.

The worth package deal contains rugged passive cooling choices, non-obligatory conformal coating for cover towards corrosion attributable to moisture or condensation, a listing of really useful provider board schematics and appropriate elements for the prolonged temperature vary for highest reliability. This spectacular technical characteristic set is complemented by a complete service providing that features temperature screening, high-speed sign compliance testing together with design-in providers and all coaching classes required to simplify the usage of congatec’s embedded pc applied sciences.

Typical use instances for the brand new industrial-grade COM-HPC and COM Categorical modules will be present in any sort of rugged purposes, out of doors edge units and in-vehicle installations, which more and more leverage embedded imaginative and prescient and synthetic intelligence (AI) capabilities for which congatec gives intensive assist as nicely. Typical verticals are industrial automation, railway and transportation, sensible infrastructure together with mission-critical purposes such because the power, oil and fuel sector, cellular ambulance tools, telecommunication, or safety and video surveillance, to call just some.

Optimum for various temperatures

Based mostly on the brand new low-power high-density Tiger Lake SoCs, the brand new modules for huge temperature environments supply considerably higher CPU efficiency and practically 3x increased GPU efficiency, together with state-of-the-art PCIe Gen4 and USB4 assist. Essentially the most demanding graphics and compute workloads profit from as much as Four cores, eight threads and as much as 96 graphics execution models for massively parallel processing throughput in an ultra-rugged form. The built-in graphics can be utilized as a parallel processing unit for convolutional neural networks (CNN) or as an AI and deep studying accelerator. Utilizing the Intel OpenVINO software program toolkit that features optimized requires OpenCV, OpenCL kernels and different business instruments and libraries, workloads will be prolonged throughout CPU, GPU and FPGA compute models to speed up AI workloads, together with pc imaginative and prescient, audio, speech, language and advice methods.

The TDP is scalable from 12W to 28W, enabling actually immersive 4k UHD system designs with passive cooling solely. The spectacular efficiency of the ultra-rugged conga-HPC/cTLU COM-HPC module and the conga-TC570 COM Categorical Sort 6 module has been made out there in a real-time succesful design and in addition contains real-time hypervisor assist from Actual-Time Programs for digital machine deployments and workload consolidation in edge computing situations.

“Providers and assist are completely key for standard-based merchandise. That’s why we complement our rugged product providing for all the brand new edge purposes in difficult environments with a complete ecosystem for every product. This contains optimization for real-time computing – together with assist for Time Delicate Networking (TSN), Time Coordinated Computing (TCC) and RTS Realtime Programs Hypervisor, distant administration assist and at last all required sign compliance providers as high-speed signalling with PCIe Gen Four and USB4 is a critical problem today, making provider board design duties more and more advanced,” explains Andreas Bergbauer, Product Line Supervisor at congatec.

The characteristic set intimately

The conga-HPC/cTLU COM-HPC Shopper Dimension A module, in addition to the conga-TC570 COM Categorical Compact module shall be out there with new scalable 11th Gen Intel Core processors for excessive temperatures starting from -40 to +85°C. Each modules are the primary to assist PCIe x4 in Gen Four efficiency to attach peripherals with large bandwidth. Additionally, designers can leverage 8x PCIe Gen 3.Zero x1 lanes. The place the COM-HPC module gives newest 2x USB 4.0, 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Categorical module gives 4x USB 3.2 Gen 2 and 8x USB 2.Zero in compliance to the PICMG specification. For networking, the COM-HPC module gives 2x 2.5 GbE, whereas the COM Categorical module executes 1x GbE, with each supporting TSN. Sound is offered through I2S and SoundWire within the COM-HPC model and HDA on the COM Categorical modules. Complete board assist packages are offered for all main RTOS, together with hypervisor assist from Actual-Time Programs in addition to Linux, Home windows and Android.

The 2 11th Gen Intel Core processor-based COM-HPC and COM Categorical Compact Sort 6 modules can be found within the following prolonged temperature vary choices:

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